TSMC 2019 China OIP Ecosystem Forum - Call-for-Paper
TSMC Open Innovation Platform Ecosystem Members:
The TSMC 2019 China Open Innovation Platform (OIP) Ecosystem Forum will be held on Tuesday, October 29 at the Hyatt Regency Beijing China.
The TSMC China Open Innovation Platform Ecosystem Forum is one-of-a-kind events that bring together the semiconductor design chain community and TSMC customer executives. The OIP Forum will feature a day long, two-track technical presentation sessions along with an Ecosystem Pavilion that will host up to 35 member companies. The Forum provides ideal venue to build relationships with TSMC customers.
The technical sessions are organized along two tracks (EDA/Design Services & IP/Design Services) with a total of 18 30-minutes presentations. Your company is eligible and encouraged to submit papers to the Forum. All papers will be reviewed by a Technical Paper Review Committee and scored based on their merit and their ability to demonstrate how TSMC technology is embedded into your products or services.
Call for Paper
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For more information about paper submissions, please contact Mr. Tom Quan at firstname.lastname@example.org.
|Important Paper Submission Dates:|
|July 31||Abstract and speaker biography submission deadline|
|September 9||Notification of selected abstracts|
|September 16||Full draft presentation slide submission due|
|September 27||Final presentation slides (print version) due|
|October 11||Final presentation slides (speech version) due|
|October 14-18||Mandatory presentation rehearsal|