For Partners


TSMC 2019 China OIP Ecosystem Forum - Call-for-Paper

TSMC Open Innovation Platform Ecosystem Members:

The TSMC 2019 China Open Innovation Platform (OIP) Ecosystem Forum will be held on Tuesday, October 29 at the Hyatt Regency Beijing China.

The TSMC China Open Innovation Platform Ecosystem Forum is one-of-a-kind events that bring together the semiconductor design chain community and TSMC customer executives. The OIP Forum will feature a day long, two-track technical presentation sessions along with an Ecosystem Pavilion that will host up to 35 member companies. The Forum provides ideal venue to build relationships with TSMC customers.

The technical sessions are organized along two tracks (EDA/Design Services & IP/Design Services) with a total of 18 30-minutes presentations. Your company is eligible and encouraged to submit papers to the Forum. All papers will be reviewed by a Technical Paper Review Committee and scored based on their merit and their ability to demonstrate how TSMC technology is embedded into your products or services.

Key benefits of participating in TSMC's China OIP Ecosystem Forum are:
Direct and exclusive access to director-level and above executives from TSMC customers that deepens your understanding of emerging design challenges and builds key relationships
An Ecosystem Pavilion that accommodates ecosystem members enabling a more intimate dialog with TSMC customers

Call for Paper

With increasing demands and growing complexities of circuits and systems, new challenges are ever emerging. Showcase your insights and solutions to key technical and industry issues at TSMC OIP Forums. We will feature high-quality presentations on topics including high-performance, low power, reliability, and advanced node design solutions and their applications in market segments such as high-performance computing, mobile computing, automotive and IoT.

We are seeking presentations that illustrate your experiences and customer successes with TSMC solutions, methodologies, and techniques. Priority will be given to joint papers with end customers. Submit an abstract for consideration at the TSMC 2019 China OIP Forum.

Hot Topics for 2019

EDA / Design Services IP / Design Services
Design platforms (HPC, Mobile, IoT, and Automotive)
5nm, 7FF/FF+, 16/12FFC, 22ULP/ULL
HPC Design Flows and Methodologies
Custom/AMS Design Flows
Low-Power Design Methodologies
Automotive Design Methodologies
CoWoS/InFO/SoIC Design Flows
Design platforms (HPC, Mobile, IoT, and Automotive)
5nm, 7FF/FF+, 16/12FFC, 22ULP/ULL
High-Speed Interface IP: USB, PCIe, DDR, LPDDR, SerDes
Non-Volatile Memories
Automotive IP
Wearables/IoT, Edge AI IP

For more information about paper submissions, please contact Mr. Tom Quan at

Important Paper Submission Dates:

July 31 Abstract and speaker biography submission deadline
September 9 Notification of selected abstracts
September 16 Full draft presentation slide submission due
September 27 Final presentation slides (print version) due
October 11 Final presentation slides (speech version) due
October 14-18 Mandatory presentation rehearsal